11.2. Terms, definitions and abbreviated terms

In this section, you will find terms, definitions and abbreviated terms used in the six previous parts.

11.2.1. Terms from other documents

a. For the purpose of this handbook, the terms and definitions from ECSS-S-ST-00-01 apply:

1. Acceptance

2. Anomaly

3. Common cause failure

4. Equipment/unit

5. Failure

6. Failure mode

7. Mechanical part

8. Part/component

9. Quality

10. Requirement

11. Spacecraft

12. Space segment

13. System

14. Test

15. Validation

16. Verification

b. For the purpose of this handbook, the terms and definitions from ECSS-Q-ST-30-02:

17. Failure Modes and Effects Analysis(FMEA)

18. Failure Modes, Effects and Criticality Analysis (FMECA)

19. Process FMECA (PFMECA)

c. For the purpose of this handbook, the terms and definitions from ECSS-E-ST-33-01:

20. Mechanism

11.2.2. Terms specific for the current handbook

For the purpose of this handbook, these definitions found in ECSS-Q-HB-30-02A apply:

Bayesian inference

a process of using data analysis to infer properties of an underlying distribution of probability in which the Bayes theorem is used to update the probability for a hypothesis as more evidence or information becomes available

Contributing factor

an event or condition that may have been one of the causes to the occurrence of an undesired outcome

Deep Sub Micron

corresponds to Integrated Circuits technologies allowing a very high integration of parts but inducing potential new phenomena, e.g. increased sensitivity to radiations and potential decreasing of operating lifetime of the parts

Degradation failure

an irreversible failure resulting from progressive degradation of an item’s performances in time due to calendar aging or due to operational and/or environmental stresses

Design FMEA

FMEA in which all potential failure modes due to design errors are identified, analysed in terms of severity, occurrence and detectability on ground, and actions plans are put into place, in order to reduce one of these three characteristics to remain within acceptable limits

EEE part

a component which performs electrical, electronic or electromechanical function and is built with one or more elements assembled in a manner that they cannot be separated without destroying the component

Epistemic uncertainty

results from our poor understanding of the relevant aspects which include statistical uncertainties and models uncertainties

Extrinsic failure

sudden failure induced by the environment on the spacecraft elements

Failure mechanism

the physical process by which an element fails (e.g. electromigration for EEE parts or fracture/fatigue for mechanical parts)

Failure mode and effects summary FMES

abstract of lower-level failure modes with the same effects from the respective lower level FMEA

Failure root cause

one of multiple factors (events, conditions or organizational factors) that contributed to or created the proximate cause and subsequent undesired outcome and, if eliminated, or modified would have prevented the undesired outcome

Handbook data source

it corresponds to a document compiling either models or data to be used for reliability calculations

In-orbit return (IOR) data

it corresponds to reliability information (Failure Rates or mission probability success) obtained through the analysis of in-orbit feedback at different levels

Interface

an interface is the junction that provides interconnection between two systems, its concept must be considered from an electrical point of view

Level of confidence

it corresponds to the probability for an interval to contain the parameter to be estimated (estimation by interval)

Manufacturer data

it corresponds to information obtained for a part, a unit or a subsystem through its manufacturing process, its physical production

Mechanical component

it is defined as a non-electronics part, i.e. a part that does not perform any EEE function

Miscellaneous item

either parts or assemblies that can neither be classified as EEE or mechanical parts/units (e.g., due to their EEE-mechanical hybrid aspect or to their complexity)

Mission lifetime

the time during which the system shall perform the specified mission (functions and performances)

Model uncertainty

it results from modelling assumptions and simplifications made

New space

a notion first introduced around 2010-2015, corresponding to an ongoing transformation of the space systems, which is driving new ways to develop space product concerning several notions, among which the overall cost and the resort to the newest technologies in the limits of their applicability for space

Pertinence

it corresponds to the consistency between what has been predicted and what can be observed

Physics of Failure

a technique under the practice of design for reliability that leverages the knowledge and understanding of the processes and mechanisms that induce failure to predict reliability and improve product performance. (source: Wikipedia)

Probability density function

for a discrete distribution, it corresponds to the potential cases for which the variate has the value x

Random failure

a failure occurring at an unexpected time due to a residual internal part defect or weakness when submitted to normal operational stresses

Reliability prediction

the process of estimating the reliability of a system or its components under specified conditions or the result of the analysis

Reliability prediction methodology

it refers to the reliability prediction process and the selection of suitable methods and models

Reliability prediction method

a process or modelling approach to perform a reliability prediction related to a certain failure event (or several events) based on the information available on it

Reliability prediction model

a mathematical representation of the real world that is based on suitable methods, data and information, and ready to perform a reliability prediction related to a certain failure event (or several events)

Reliability prediction space application

application (of a reliability prediction methodology, method or model) for a system that is intended to operate in space.

Safe life qualification

qualification process for a product regarding its capability to sustain its specified design lifetime (degradation(s) compliant with the specification)

Simplified structural reliability method

it corresponds to a less developed form of structural reliability methods, which needs less knowledge of probabilistic methods to be established and can be solved analytically

Statistical method

a technique for which RP models are based on what has been observed on an item in terms of functioning/non-functioning, generally through tests or field return, without further analysis of the potential root cause or failure mechanism

Statistical uncertainty

it results from limited data samples used to derive a model (e.g. cumulated hours, observed failures) used to derive a model

Structural reliability method

a class of Physics of Failure techniques which are based on a mathematical model of the failure mechanism(s) for a specific part or item (not limited to structures) and probabilistic modelling of the uncertainties associated with the relevant physical variables (e.g., the stress-strength interference method for structural parts is a simple example for the usage of structural reliability methods)

Sudden failure

a failure for which the transition from the normal state (nominal performances of the elements) to the failed state is instantaneous or is very short

Systematic failure

a failure, related in a deterministic way to a certain cause, which can only be eliminated by a modification of the design, the manufacturing process or the operational procedures

System engineering

an interdisciplinary approach and means to enable the realization of successful systems which focuses on defining customer needs and required functionality early in the development cycle, documenting requirements, and then proceeding with design synthesis and system validation while considering the complete problem: operations, cost and schedule, performance, training and support, test, manufacturing, and disposal (International Council on Systems Engineering INCOSE)

Technological limits (TBC)

refers to the highest value for some given characteristics for a reference covering a range of values.

Test data

it corresponds to reliability data obtained through tests

Wear-out failure

a progressive failure characterized by an evolution in time - or equivalent time, such as cycles - of an item’s performances (modification of the design characteristics due to a degradation process) up to a definitive failure

11.2.3. Abbreviated terms and symbols

For the purpose of this standards, the abbreviated terms and symbols from ECSS-S-ST-00-01 and the following apply:

AC

Alternative Current

AD

Applicable Document

AEC

Automotive Electronic Council

AECMA

European Association of Aerospace Industries (Association Européenne des Constructeurs de Matériel Aerospatial)

AEC-Q

Automotive Electronic Council Quality

AF

Acceleration Factor

AOCS

Attitude and Orbit Control System

AR

Acceptance Review

ARINC

Aeronautical Radio Incorporated

ASIC

Application Specific Integrated Circuits

BGA

Ball Grid Array

BiCMOS

Bipolar Complementary Metal Oxide Semiconductor

BR

Bibliographic Reference

BS

British Standard

BTI

Bias Temperature Instability

CAMP

Channel Amplifier

CCD

Charge Coupled Device

CCF

Common Cause Failure

CCS

Common Cause Susceptibility Score

CDR

Critical Design Review

CECC

Cenelec Electronic Components Committee

CERDIP

Ceramic Dual Inline Package

CLT

Central Limit Theorem

CMOS

Complementary Metal Oxide Semiconductor

CNES

Centre National d’Etudes Spatiales

COTS

Component On The Shelf

CoV

Coefficient of Variation

CPGA

Ceramic Pin Grid Array

CPLD

Complex Programmable Logic Device

CRM

Classical Reliability Method

CRR

Commissioning Results Review

CTE

Coefficient of Thermal Expansion

CV

Capacitance Voltage

DAG

Directed Acyclic Graph

DC

Direct Current

DD

Displacement Damage

DEG

Degradation failure

DEP

Deployment

DET

Detectability

DFMEA

Design Failure Mode Effect Analysis

DHS

Data Handling System

DoE

Design of Experiment

DRAM

Dynamic Random Access Memory

DSM

Deep Sub Micron

DSP

Digital Signal Processor

Ea

Activation Energy

ECSS

European Cooperation for Space Standardization

EEE

Electric, Electronic, Electro-mechanical

EEPROM

Electrical Erasable Programmable Read Only Memory

EIA

Electronic Industries Alliance

ELR

End-of-Life Review

EM

Electromigration

EMC

Electro Magnetic Compatibility

EPPL

ESA Preferred Part List

EPROM

Electrical Programmable Read Only Memory

ESA

European Space Agency

ESD

Electro Static Discharge

ETA

Event Tree Analysis

EX

Extrinsic failure

FCV

Flow Control Valve

FDIR

Fault Detection Isolation and Recovery

FET

Field Effect Transistor

FIT

Failure In Time

FMD

Failure Mode/Mechanism Distribution

FMEA

Failure Mode Effect Analysis

FMECA

Failure Mode Effect and Criticality Analysis

FMES

Failure Mode Effect Summary

FOO

Feasibility Of Objectives

FORM

First Order Reliability Method

FPGA

Field Programmable Gate Array

FR

Failure Rate

FRR

Flight Readiness Review

FTA

Fault Tree Analysis

GaAs

Gallium Arsenide

GaN

Gallium Nitride

GEO

Geostationary Orbit

HCI

Hot Carrier Injection

HDBK

Handbook

HET

Hall Effect Thruster

HPA

High Power Amplifier

HW

Hardware

IC

Integrated Circuits

IEC

International Electrotechnical Commission

IEEE

Institute of Electrical and Electronics Engineers

IGBT

Insulated Gate Bipolar Transistor

IOR

In Orbit Return

IOT

In-Orbit Testing

IPC

Association connecting Electronics Industries

I_SA

SA current

JAN

Joint Army Navy (quality level for semiconductors)

JANS

Joint Army Navy Space (quality level for semiconductors)

JANTX

Joint Army Navy Testing Ectra (quality level for semiconductors)

JANTXV

Joint Army Navy Testing Extra with Visual (quality level for semiconductors)

JEDEC

Joint Electron Device Engineering Council

JEP

JEDEC Publications

JESD

JEDEC Standard

JFET

Junction Field Effect Transistor

LCD

Liquid Crystal Display

LED

Light Emitting Diode

LEO

Low Earth Orbit

LMS

Least Mean Square

LoC

Level of Confidence

LRR

Launch Readiness Review

LV

Latching Valve

MC

Minimal Cut set

MCCV

Maximum Common Cause Value

MCM

Multi Chip Module

MCMC

Markov Chain Monte Carlo

MCR

Mission Closure Review

MCS

Monte Carlo Simulations

MDR

Mission Definition Review

MEC

Mechanical

MEO

Medium Earth Orbit

MIL

Military

MIS

Miscellaneous

MMIC

Microwave Monolithic Integrated Circuits

MMOD

Micrometeoroid and Orbital Debris

MMPDS

Metallic Materials Properties Development and Standardization

MoM

Method of Moments

MOS

Metal Oxid Semi-conductor

MOSFET

Metal Oxide Semi-conductor Field Effect Transistor

MPM

Microwave Power Module

MTBF

Mean Time Between Failure

MTTF

Mean Time To Failure

MW

Micro Wave

NA

Not Applicable

NaN

Not a Number

NASA

National Aeronautics and Space Administration

NASDA

National Space Development Agency of Japan

NDE

Non-Destructive Evaluation

NEA

Non Explosive Actuator

NIST

National Institute of Standards and Technology

NMOS

N Channel MOSFET

NPRD

Non-Electronic Parts Reliability Data

NRPM

New Reliability Prediction Methodology

N-STD

Non-Standard

NSWC

Naval Surface Warfare Center

O

Oxygen

OCC

Occurence

OLR

Outgoing Longwave Radiation

O/O

On/Off

ORR

Operation Readiness Review

PAL

Programmable Array Logic

PBGA

Plastic Ball Grid Array

PCB

Printed Circuit Board

PDF

Probability Density Function

PDR

Preliminary Design Review

PEN

Polyethylene Naphtalate

PFMEA

Process Failure Mode Effect Analysis

PHEMT

Pseudomorphic High Electron Mobility Transistor

PL

PayLoad

POD

Probability Of Detection

PoF

Physics of Failure

PPS

Polyphenylene Sulfide

PROM

Programmable Read Only Memory

PROP

Propulsion

PRR

Preliminary Requirements Review

PT

Pressure Transducer

PTFE

PolyTetraFluoroEthylene (Teflon)

PTH

Pin To Hole

PWR

Power

PYRO

Pyrotechnics

QA

Quality Assurance

QR

Qualification Review

RAMS

Reliability Availability Maintainability Safety

RBD

Reliability Block Diagram

REF

Reference

RF

Random Failure / Radio Frequency

RP

Reliability Prediction

RPDSM

Reliability Prediction Data Sources and Methodologies

RPN

Risk Priority Number

RUL

Remaining Useful Life

RW

Reaction Wheel

S/N

Stress / Number of cycles to failure

SA

Solar Array

SADM

Solar Array Drive Mechanism

SAE

Society of Automotive Engineering

SCC

Stress Corrosion Cracking

SCU

Space Computer Unit

SDIP

Skinny Dual In Line Package

SEB

Single Event Burnout

SEE

Single Event Effects

SEL

Single Event Latch up

SEP

Single Event Phenomena

SEU

Single Event Upset

SEV

Severity

SF

Systematic Failure

Si

Silicium

SiGe

Silicium Germanium

SM

Stress Migration

SMD

Surface Mount Device

SnPb

Tin-Lead Solder

SORM

Second Order Reliability Method

SPF

Single Point Failure

SRAM

Static Random Access Memory

SRM

Structural Reliability Method

SRR

System Requirements Review

SSPA

Solid State Power Amplifier

STD

Standard

STN

Satellite Telecommunications Network

STRU

Structure

SW

Software

SYS

System

TDDB

Time-Dependent Dielectric Breakdown

TFT

Thin Film Transistor

THER

Thermal

TID

Total-Ionizing Dose

TM

Telemetry

TMI

(TBD)

TN

Technical Note

TNID

Total Non Ionizing Dose

TRL

Technology Readiness Level

TTC

(TTC)

TTF

Time-To-Failure

TVS

Transient Voltage Suppressor

TWTA

Travelling Wave Tube Amplifier

UTE

Union Technique de l’Electricité

UV

Ultra Violet