(accronyms)= # Terms, definitions and abbreviated terms In this section, you will find terms, definitions and abbreviated terms used in the six previous parts. ## Terms from other documents a. For the purpose of this handbook, the terms and definitions from ECSS-S-ST-00-01 apply: ```{glossary} 1. Acceptance 2. Anomaly 3. Common cause failure 4. Equipment/unit 5. Failure 6. Failure mode 7. Mechanical part 8. Part/component 9. Quality 10. Requirement 11. Spacecraft 12. Space segment 13. System 14. Test 15. Validation 16. Verification ``` b. For the purpose of this handbook, the terms and definitions from ECSS-Q-ST-30-02: ```{glossary} 17. Failure Modes and Effects Analysis(FMEA) 18. Failure Modes, Effects and Criticality Analysis (FMECA) 19. Process FMECA (PFMECA) ``` c. For the purpose of this handbook, the terms and definitions from ECSS-E-ST-33-01: ```{glossary} 20. Mechanism ``` ## Terms specific for the current handbook For the purpose of this handbook, these definitions found in ECSS-Q-HB-30-02A apply: ```{glossary} Bayesian inference a process of using data analysis to infer properties of an underlying distribution of probability in which the Bayes theorem is used to update the probability for a hypothesis as more evidence or information becomes available Contributing factor an event or condition that may have been one of the causes to the occurrence of an undesired outcome Deep Sub Micron corresponds to Integrated Circuits technologies allowing a very high integration of parts but inducing potential new phenomena, e.g. increased sensitivity to radiations and potential decreasing of operating lifetime of the parts Degradation failure an irreversible failure resulting from progressive degradation of an item’s performances in time due to calendar aging or due to operational and/or environmental stresses Design FMEA FMEA in which all potential failure modes due to design errors are identified, analysed in terms of severity, occurrence and detectability on ground, and actions plans are put into place, in order to reduce one of these three characteristics to remain within acceptable limits EEE part a component which performs electrical, electronic or electromechanical function and is built with one or more elements assembled in a manner that they cannot be separated without destroying the component Epistemic uncertainty results from our poor understanding of the relevant aspects which include statistical uncertainties and models uncertainties Extrinsic failure sudden failure induced by the environment on the spacecraft elements Failure mechanism the physical process by which an element fails (e.g. electromigration for EEE parts or fracture/fatigue for mechanical parts) Failure mode and effects summary FMES abstract of lower-level failure modes with the same effects from the respective lower level FMEA Failure root cause one of multiple factors (events, conditions or organizational factors) that contributed to or created the proximate cause and subsequent undesired outcome and, if eliminated, or modified would have prevented the undesired outcome Handbook data source it corresponds to a document compiling either models or data to be used for reliability calculations In-orbit return (IOR) data it corresponds to reliability information (Failure Rates or mission probability success) obtained through the analysis of in-orbit feedback at different levels Interface an interface is the junction that provides interconnection between two systems, its concept must be considered from an electrical point of view Level of confidence it corresponds to the probability for an interval to contain the parameter to be estimated (estimation by interval) Manufacturer data it corresponds to information obtained for a part, a unit or a subsystem through its manufacturing process, its physical production Mechanical component it is defined as a non-electronics part, i.e. a part that does not perform any EEE function Miscellaneous item either parts or assemblies that can neither be classified as EEE or mechanical parts/units (e.g., due to their EEE-mechanical hybrid aspect or to their complexity) Mission lifetime the time during which the system shall perform the specified mission (functions and performances) Model uncertainty it results from modelling assumptions and simplifications made New space a notion first introduced around 2010-2015, corresponding to an ongoing transformation of the space systems, which is driving new ways to develop space product concerning several notions, among which the overall cost and the resort to the newest technologies in the limits of their applicability for space Pertinence it corresponds to the consistency between what has been predicted and what can be observed Physics of Failure a technique under the practice of design for reliability that leverages the knowledge and understanding of the processes and mechanisms that induce failure to predict reliability and improve product performance. (source: Wikipedia) Probability density function for a discrete distribution, it corresponds to the potential cases for which the variate has the value x Random failure a failure occurring at an unexpected time due to a residual internal part defect or weakness when submitted to normal operational stresses Reliability prediction the process of estimating the reliability of a system or its components under specified conditions or the result of the analysis Reliability prediction methodology it refers to the reliability prediction process and the selection of suitable methods and models Reliability prediction method a process or modelling approach to perform a reliability prediction related to a certain failure event (or several events) based on the information available on it Reliability prediction model a mathematical representation of the real world that is based on suitable methods, data and information, and ready to perform a reliability prediction related to a certain failure event (or several events) Reliability prediction space application application (of a reliability prediction methodology, method or model) for a system that is intended to operate in space. Safe life qualification qualification process for a product regarding its capability to sustain its specified design lifetime (degradation(s) compliant with the specification) Simplified structural reliability method it corresponds to a less developed form of structural reliability methods, which needs less knowledge of probabilistic methods to be established and can be solved analytically Statistical method a technique for which RP models are based on what has been observed on an item in terms of functioning/non-functioning, generally through tests or field return, without further analysis of the potential root cause or failure mechanism Statistical uncertainty it results from limited data samples used to derive a model (e.g. cumulated hours, observed failures) used to derive a model Structural reliability method a class of Physics of Failure techniques which are based on a mathematical model of the failure mechanism(s) for a specific part or item (not limited to structures) and probabilistic modelling of the uncertainties associated with the relevant physical variables (e.g., the stress-strength interference method for structural parts is a simple example for the usage of structural reliability methods) Sudden failure a failure for which the transition from the normal state (nominal performances of the elements) to the failed state is instantaneous or is very short Systematic failure a failure, related in a deterministic way to a certain cause, which can only be eliminated by a modification of the design, the manufacturing process or the operational procedures System engineering an interdisciplinary approach and means to enable the realization of successful systems which focuses on defining customer needs and required functionality early in the development cycle, documenting requirements, and then proceeding with design synthesis and system validation while considering the complete problem: operations, cost and schedule, performance, training and support, test, manufacturing, and disposal (International Council on Systems Engineering INCOSE) Technological limits (TBC) refers to the highest value for some given characteristics for a reference covering a range of values. Test data it corresponds to reliability data obtained through tests Wear-out failure a progressive failure characterized by an evolution in time - or equivalent time, such as cycles - of an item’s performances (modification of the design characteristics due to a degradation process) up to a definitive failure ``` ## Abbreviated terms and symbols For the purpose of this standards, the abbreviated terms and symbols from ECSS-S-ST-00-01 and the following apply: ```{glossary} AC Alternative Current AD Applicable Document AEC Automotive Electronic Council AECMA European Association of Aerospace Industries (Association Européenne des Constructeurs de Matériel Aerospatial) AEC-Q Automotive Electronic Council Quality AF Acceleration Factor AOCS Attitude and Orbit Control System AR Acceptance Review ARINC Aeronautical Radio Incorporated ASIC Application Specific Integrated Circuits BGA Ball Grid Array BiCMOS Bipolar Complementary Metal Oxide Semiconductor BR Bibliographic Reference BS British Standard BTI Bias Temperature Instability CAMP Channel Amplifier CCD Charge Coupled Device CCF Common Cause Failure CCS Common Cause Susceptibility Score CDR Critical Design Review CECC Cenelec Electronic Components Committee CERDIP Ceramic Dual Inline Package CLT Central Limit Theorem CMOS Complementary Metal Oxide Semiconductor CNES Centre National d'Etudes Spatiales COTS Component On The Shelf CoV Coefficient of Variation CPGA Ceramic Pin Grid Array CPLD Complex Programmable Logic Device CRM Classical Reliability Method CRR Commissioning Results Review CTE Coefficient of Thermal Expansion CV Capacitance Voltage DAG Directed Acyclic Graph DC Direct Current DD Displacement Damage DEG Degradation failure DEP Deployment DET Detectability DFMEA Design Failure Mode Effect Analysis DHS Data Handling System DoE Design of Experiment DRAM Dynamic Random Access Memory DSM Deep Sub Micron DSP Digital Signal Processor Ea Activation Energy ECSS European Cooperation for Space Standardization EEE Electric, Electronic, Electro-mechanical EEPROM Electrical Erasable Programmable Read Only Memory EIA Electronic Industries Alliance ELR End-of-Life Review EM Electromigration EMC Electro Magnetic Compatibility EPPL ESA Preferred Part List EPROM Electrical Programmable Read Only Memory ESA European Space Agency ESD Electro Static Discharge ETA Event Tree Analysis EX Extrinsic failure FCV Flow Control Valve FDIR Fault Detection Isolation and Recovery FET Field Effect Transistor FIT Failure In Time FMD Failure Mode/Mechanism Distribution FMEA Failure Mode Effect Analysis FMECA Failure Mode Effect and Criticality Analysis FMES Failure Mode Effect Summary FOO Feasibility Of Objectives FORM First Order Reliability Method FPGA Field Programmable Gate Array FR Failure Rate FRR Flight Readiness Review FTA Fault Tree Analysis GaAs Gallium Arsenide GaN Gallium Nitride GEO Geostationary Orbit HCI Hot Carrier Injection HDBK Handbook HET Hall Effect Thruster HPA High Power Amplifier HW Hardware IC Integrated Circuits IEC International Electrotechnical Commission IEEE Institute of Electrical and Electronics Engineers IGBT Insulated Gate Bipolar Transistor IOR In Orbit Return IOT In-Orbit Testing IPC Association connecting Electronics Industries I_SA SA current JAN Joint Army Navy (quality level for semiconductors) JANS Joint Army Navy Space (quality level for semiconductors) JANTX Joint Army Navy Testing Ectra (quality level for semiconductors) JANTXV Joint Army Navy Testing Extra with Visual (quality level for semiconductors) JEDEC Joint Electron Device Engineering Council JEP JEDEC Publications JESD JEDEC Standard JFET Junction Field Effect Transistor LCD Liquid Crystal Display LED Light Emitting Diode LEO Low Earth Orbit LMS Least Mean Square LoC Level of Confidence LRR Launch Readiness Review LV Latching Valve MC Minimal Cut set MCCV Maximum Common Cause Value MCM Multi Chip Module MCMC Markov Chain Monte Carlo MCR Mission Closure Review MCS Monte Carlo Simulations MDR Mission Definition Review MEC Mechanical MEO Medium Earth Orbit MIL Military MIS Miscellaneous MMIC Microwave Monolithic Integrated Circuits MMOD Micrometeoroid and Orbital Debris MMPDS Metallic Materials Properties Development and Standardization MoM Method of Moments MOS Metal Oxid Semi-conductor MOSFET Metal Oxide Semi-conductor Field Effect Transistor MPM Microwave Power Module MTBF Mean Time Between Failure MTTF Mean Time To Failure MW Micro Wave NA Not Applicable NaN Not a Number NASA National Aeronautics and Space Administration NASDA National Space Development Agency of Japan NDE Non-Destructive Evaluation NEA Non Explosive Actuator NIST National Institute of Standards and Technology NMOS N Channel MOSFET NPRD Non-Electronic Parts Reliability Data NRPM New Reliability Prediction Methodology N-STD Non-Standard NSWC Naval Surface Warfare Center O Oxygen OCC Occurence OLR Outgoing Longwave Radiation O/O On/Off ORR Operation Readiness Review PAL Programmable Array Logic PBGA Plastic Ball Grid Array PCB Printed Circuit Board PDF Probability Density Function PDR Preliminary Design Review PEN Polyethylene Naphtalate PFMEA Process Failure Mode Effect Analysis PHEMT Pseudomorphic High Electron Mobility Transistor PL PayLoad POD Probability Of Detection PoF Physics of Failure PPS Polyphenylene Sulfide PROM Programmable Read Only Memory PROP Propulsion PRR Preliminary Requirements Review PT Pressure Transducer PTFE PolyTetraFluoroEthylene (Teflon) PTH Pin To Hole PWR Power PYRO Pyrotechnics QA Quality Assurance QR Qualification Review RAMS Reliability Availability Maintainability Safety RBD Reliability Block Diagram REF Reference RF Random Failure / Radio Frequency RP Reliability Prediction RPDSM Reliability Prediction Data Sources and Methodologies RPN Risk Priority Number RUL Remaining Useful Life RW Reaction Wheel S/N Stress / Number of cycles to failure SA Solar Array SADM Solar Array Drive Mechanism SAE Society of Automotive Engineering SCC Stress Corrosion Cracking SCU Space Computer Unit SDIP Skinny Dual In Line Package SEB Single Event Burnout SEE Single Event Effects SEL Single Event Latch up SEP Single Event Phenomena SEU Single Event Upset SEV Severity SF Systematic Failure Si Silicium SiGe Silicium Germanium SM Stress Migration SMD Surface Mount Device SnPb Tin-Lead Solder SORM Second Order Reliability Method SPF Single Point Failure SRAM Static Random Access Memory SRM Structural Reliability Method SRR System Requirements Review SSPA Solid State Power Amplifier STD Standard STN Satellite Telecommunications Network STRU Structure SW Software SYS System TDDB Time-Dependent Dielectric Breakdown TFT Thin Film Transistor THER Thermal TID Total-Ionizing Dose TM Telemetry TMI (TBD) TN Technical Note TNID Total Non Ionizing Dose TRL Technology Readiness Level TTC (TTC) TTF Time-To-Failure TVS Transient Voltage Suppressor TWTA Travelling Wave Tube Amplifier UTE Union Technique de l'Electricité UV Ultra Violet ```