Bibliographic references

3.5. Bibliographic references#

[BR_EEE_1]

Airbus Defence & Space (ADS). Tec-qqd study - reliability prediction data sources and methodologies for space applications. Standard ADS-RPDSM-FR, ADS, 2016.

[BR_EEE_2]

Electronic Industries Alliance. Engineering bulletin - acceleration factors. Technical Report, Electronic Industries Alliance, 1999.

[BR_EEE_3]

James R. Black. Electromigration of al-si alloy films. 16th International Reliability Physics Symposium, pages 233–240, 1978. URL: https://ieeexplore.ieee.org/document/4208242, doi:https://doi.org/10.1109/IRPS.1978.362852.

[BR_EEE_4]

International Electrotechnical Commission. Miniature fuses - part 1: definitions for miniature fuses and general requirements for miniature fuse-links. Technical Report, IEC, 2006. URL: https://webstore.iec.ch/preview/info_iec60127-1%7Bed2.0%7Den.pdf.

[BR_EEE_5]

International Electrotechnical Commission. Weibull analysis. Technical Report, IEC, 2008. URL: https://www.jedec.org/standards-documents/docs/jesd-202.

[BR_EEE_6]

International Electrotechnical Commission. Reliability data handbook - universal model for reliability prediction of electronics components, pcbs and equipment. Technical Report, IEC, 2010. URL: https://webstore.iec.ch/publication/6946.

[BR_EEE_7]

Automotive Electronics Council. Failure mechanisms based stress test qualification for integrated circuits. Technical Report, AEC, 2014. URL: http://www.aecouncil.com/Documents/AEC_Q100_Rev_H_Base_Document.pdf.

[BR_EEE_8]

A. Dufour. Cnes study: reliability versus on / off cycles - methodology and implementation. Technical Report, CNES, 2016. URL: https://escies.org/download/webDocumentFile?id=63954.

[BR_EEE_9]

ESA. European preferred parts list. Technical Report, ESA, 2018. URL: https://escies.org/download/webDocumentFile?id=66841.

[BR_EEE_10]

Chester J. Everline, Karla B. Clark, G. Man, Robert D. Rasmussen, Allan H. Johnston, Charles Kohlhase, and Todd Paulos. Estimating the reliability of electronic parts in high radiation fields. In NASA Jet Propulsion Laboratory. 2008. URL: https://www.hkarms.org/ASUS_Server/psam9.sytes.netweb_resources_20080518_PSAM9/Parallel_Session/A_Harbour_I/Wed_7-9/A8_1330-1500/Estimating_the_Reliability_of_Electronic_Parts_in_High_Radiation_Fields.pdf.

[BR_EEE_11]

European Cooperation for Space Standardization (ECSS). Space product assurance - derating - eee components. Technical Report, ECSS, 2008. URL: https://ecss.nl/standard/ecss-q-st-30-11c-derating-eee-components/.

[BR_EEE_12]

European Cooperation for Space Standardization (ECSS). Space product assurance - end of life parameter drifts - eee components. Technical Report, ECSS, 2010. URL: https://ecss.nl/hbstms/ecss-q-tm-30-12a-end-of-life-parameter-drifts-eee-components/.

[BR_EEE_13]

Garmanage and Farvagny-le-Petit. Metallized film capacitor lifetime evaluation and failure mode analysis. In CAS-CERN Accelerator School: Power Converters,. 2015. URL: https://cds.cern.ch/record/2038610/files/45-56-Gallay.pdf.

[BR_EEE_14]

Charles A. Harper. Passive electronic component handbook. In Passive Electronic Component Handbook. 1997. URL: https://books.google.fr/books/about/Passive_Electronic_Component_Handbook.html?id=OtlKBAcFBQAC&redir_esc=y.

[BR_EEE_15]

JEDEC. Method for characterizing the electromigration failure time distribution of interconnects under constant-current and temperature stress. Technical Report, JEDEC, 2006. URL: https://www.jedec.org/taxonomy/term/3155.

[BR_EEE_16]

JEDEC. Reliability qualification of semiconductor devices based on physics of failure risk and opportunity assessment. Technical Report, JEDEC, 2014. URL: https://www.jedec.org/standards-documents/docs/jep-148a.

[BR_EEE_17]

JEDEC. Application specific qualification using knowledge based test methodology. Technical Report, JEDEC, 2015. URL: https://www.jedec.org/standards-documents/docs/jesd-94a.

[BR_EEE_18]

JEDEC. Failure mechanisms and models for semiconductor devices. Technical Report, JEDEC, 2016. URL: https://www.jedec.org/standards-documents/docs/jep-122e.

[BR_EEE_19]

JEDEC. Lognormal analysis of uncensored data and of singly right censored data utilizing the persson and rootzen method. Technical Report, JEDEC, 2017. URL: https://www.jedec.org/standards-documents/docs/jesd-37.

[BR_EEE_20]

JEDEC. Foundry process qualification guidelines (wafer fabrication manufacturing sites). Technical Report, JEDEC, 2018. URL: https://www.jedec.org/standards-documents/docs/jp-00101.

[BR_EEE_21]

Henry Livingston. Guidelines for using plastic encapsulated micro-circuits and semiconductors in military, aerospace and other rugged applications. Technical Report, IEEE, 2000. URL: https://nepp.nasa.gov/docuploads/77082CF9-CD35-4B5F-9CAE5004DE386E64/Guidelines%20for%20using%20PEMs.pdf.

[BR_EEE_22]

Keith C. Norris and A. H. Landzberg. Reliability of controlled collapse interconnections. Ibm Journal of Research and Development, 13:266–271, 1969. URL: https://doi.org/10.1147/RD.133.0266, doi:https://doi.org/10.1147/RD.133.0266.

[BR_EEE_23]

NPFC. Ionizing dose and neutron hardness assurance guidelines for microcircuits and semiconductor devices. Technical Report, NPFC, 1994. URL: https://standards.globalspec.com/std/9896313/MIL-HDBK-814.

[BR_EEE_24]

UL Standard. Ul standard for safety low-voltage fuses - part 14: supplemental fuses. Technical Report, UL Standard, 2000. URL: https://www.shopulstandards.com/ProductDetail.aspx?productId=UL248-14.

[BR_EEE_25]

Telcordia. Reliability prediction procedure for electronic equipment. Technical Report, Telcordia, 2006. URL: https://telecom-info.njdepot.ericsson.net/site-cgi/ido/docs.cgi?ID=SEARCH&DOCUMENT=SR-332.

[BR_EEE_26]

Denis Tourtelier, Julien Rigo, Thibault Savatier, and Franck Davenel. Comparison of fides assesment methods. In Congrès Lambda Mu 21 Maîtrise des risques et transformation numérique : opportunités et menaces. 2018. URL: https://hal.archives-ouvertes.fr/hal-02065193.

[BR_EEE_28]

Qunyong Wang, Dongmei Chen, and Hua Bai. A method of space radiation environment reliability prediction. 2016 Annual Reliability and Maintainability Symposium (RAMS), pages 1–6, 2016. URL: https://ieeexplore.ieee.org/document/7448073, doi:https://doi.org/10.1109/RAMS.2016.7448073.